PCB Capabilities

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PCB Capabilities 2018

Item	Production Capability (Summery)
Layer Counts	1-32
Substrate Material	FR-4(including High Tg 170, High CTI>600V); Aluminum based; RO4350B, RO4003C; XPC and FR-1 (upon request)
Maximum Size	Flying test: 900600mm, Fixture test 460380mm, No test 1100*600 mm
Board Outline Tolerance	±0.15 mm
PCB Thickness	0.20 mm--6.00 mm
Thickness Tolerance(T≥0.8mm)	±8%
Thickness Tolerance(t＜0.8mm)	±10%
Insulation Layer Thickness	0.075 mm--5.00 mm
Minimum Track	0.075 mm
Minimum Space	0.075 mm
Outer Copper Thickness	35 um--420 um
Inner Copper Thickness	17 um--210 um
Drill Hole(Mechanical)	0.15 mm--6.35 mm
Finished Hole(Mechanical)	0.10 mm--6.30 mm
DiameterTolerance(Mechanical)	0.075 mm
Registration (Mechanical)	0.05 mm
Aspect Ratio	12:1
Solder Mask Type	LPI
Minimum Soldermask Bridge	0.08 mm
Minimum Soldermask Clearance	0.05 mm
Plug via Diameter	0.25 mm--0.60 mm
Impedance Control Tolerance	±10%
Surface Finish	HASL, HASL Lead Free, Immersion Gold, Immersion Tin, Immersion Silver, OSP, Gold Finger

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